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Communication Module

首页产品模块Communication Module

为弥补有线 LAN 以太网的缺点，基于IEEE802.11技术，实现按各规格进行近距离数据传送用的无限发射及接收系统的产品。根据每种传输方式和使用频带不同，主要分为 WiFi Module 和 WiGig Module，根据Wireless LAN 支持所需的应用程序不同，提供多种产品。

WiFi Module

提供无线互联网或设备间无线通信的近距离通信模块。主要在2.4GHz, 5GHz频带，使用小型、薄型元件，采用小型化封装工艺，提供高密度、小型化模块解决方法。

应用
智能手机、平板、笔记本电脑、家电产品
General Features
IEEE 802.11 a/b/g/n/ac/ax Standard Compliant

特点

  • Simulation and Analysis

    为实现高性能、低功耗进行设计优化

  • Discrete (CoB), Module 40% Down

    采用高密度、小型封装工艺

  • 为提供无线高速通信
    先行采用新规格技术
  • 致力于WiFi研发和大量
    生产最尖端产品20年，
    拥有被证实的生产能力
  • 与IC 企业建立战
    略伙伴关系
  • 构建通过元件内在化
    的稳定 SCM

Lineup

Lineup 11n Single / BT, 11ac 2x2 MIMO, RSDB etc.
11n Single / BT 11ac 2x2 MIMO RSDB RSDB + LAA 11ax

Broadcom

  • 11bgn (SDIO3.0)
  • BT4.1 with BT PA

Broadcom

  • 11ac, 2x2 MiMo (SDIO3.0)
  • BT4.0, Ext BPF

Broadcom

  • 11ac, 2x2 MiMo / PCIe
  • BT4.2, Ext BPF

Broadcom

  • 11ac 2x2 Mu-MiMo / PCIe
  • BT5.0, Ext BPF, Shield-Type

Broadcom

  • 11ax 2x2 Mu-MiMo / PCIe
  • BT5.0, ext BPF&DPX/LAA Shield-Type

Broadcom

  • BT4.1 LE

Broadcom

  • 11ac, 2x2 MiMo / PCIe
  • BT4.1, BT AoA, Ext BPF

Broadcom

  • 11ac, 2x2 MiMo / PCIe
  • BT4.2, Ext BPF, Shield-Type

Broadcom

  • 11ac 2x2 Mu-MiMo / PCIe
  • BT5.0, Ext BPF, Shield-Type

Broadcom 正在开发

  • 11ax 2x2 Mu-MiMo (160MHz) / PCIe
  • BT5.1, ext BPF&DPX/LAA Shield-Type
 

Qualcomm

  • 11ac, 1x1 MiMo
  • BT4.0, Int BPF

Qualcomm

  • 11ac, 2x2 MU-MiMo
  • BT5.1, Int BPF

Qualcomm

  • 11ac, 2x2 MU-MiMo
  • BT5.1, Int BPF

Qualcomm 正在开发

  • 11ax, 2x2 MU-MiMo / PCIe
  • BT5.1, Int BPF, 2.4G/5G FE IC Shield-Type
 

Qualcomm

  • 11ac, 2x2 MiMo / PCIe
  • 2.4G PA/LNA, 5G FEM
  • BT4.1, Ext BPF, Shield-Type
      

WiGig Module

与WiFi Module不同，利用 60GHz mmWave 频带，因此比现有的WiFi拥有更高的传输率，为需要超高速数据传输的应用提供适合的解决方法。
WiGig Module主要分为包括天线和 RF IC的 RF Antenna Module以及 Baseband Module，根据各应用，拥有多种组成系列。

应用
智能手机、平板、笔记本电脑、家电产品、VR/AR、CPE/Router、FWA/Backhaul
General Features
IEEE 802.11 ad/ay Standard Compliant

特点

  • Simulation and Analysis

    通过高传输率
    提供适合超高速数据传输的解决方法

  • Discrete (CoB), Module 40% Down

    通过天线模拟和分析技术
    实现高性能特性设计最优化

  • 为提供无线高速通信
    先行采用新规格技术
  • 稳定的量产能力
  • 通过与IC 企业简历战略伙伴关系
    载入参考模块

Lineup

Lineup 11ad, Pre-11ay, Mobile, Fixed etc.
  11ad Pre-11ay
Mobile Fixed Mobile Fixed
Baseband Module

Qualcomm

  • 11ad BB PCIe Gen2
  • 1 RF Port
  • Q’com Reference

Qualcomm

  • 11ad BB PCIe Gen2
  • 3/8 RF Ports
  • Up to 4.6Gbps PHY. Rate
  • Q’com Reference

Qualcomm 正在开发

  • Pre-11ay BB PCIe Gen3
  • Up to 10Gbps PHY. Rate
  • Q’com Reference

Qualcomm 正在开发

  • Pre-11ay BB PCIe Gen3
  • 4 RF Ports
  • Up to 10Gbps PHY. Rate
  • Q’com Reference
RF Antenna Module

Qualcomm

  • 32 Chains
  • 20 ANTs Integrated
  • Q’com Reference

Qualcomm

  • 32 Chains
  • 32 ANTs Integrated
  • Q’com Reference

Qualcomm 正在开发

  • Pre-11ay, 17-Chains
  • 15 ANTs Integrated
  • Slim Feature
  • Q’com Reference

Qualcomm 正在开发

  • Pre-11ay, 32 Chains
  • 64 ANTs Integrated
  • Q’com Reference
   

Qualcomm

  • Pre-11ay, 32-Chains
  • 22 ANTs Integrated
  • Q’com Reference
  

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