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BGA 生产基地在韩国世宗事业场，FCBGA 产品有韩国釜山事业场和海外越南生产基地。
可用于PC、游戏机、Data Center、汽车等多种领域。
- Client: Desktop, Note PC用 CPU 及 GPU, Game Console用 SoC
- HPC: Server用CPU, AI 加速器用ASIC
- Network: Router/Switch用 ASIC
- Automotive: ADAS, Radar 及 Infotainment 用 SoC
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三星电机主要提供OSP和ENEPIG工艺来进行 FCBGA的表面处理，但必要时还可进行新表面处理工艺的开发和应对。
对于BGA 产品，主要提供ENEPIG、Ni/Au、Direct Au 等工艺，电解Ni/Au可分为 Thick Ni/Au 和 Thin Ni/Au。
Mobile AP用FCCSP作为市场的领头羊，为移动设备市场的主要客户提供多种技术 Solution。Memory MDRAM、Flash、eMCP/eMMC用FBGA以2000年代初 0.22T 厚度的CSP基板为开端，提供0.1T 以下的超薄板 CSP 及三层以上的Build-up 产品。
Client CPU 及 GPU用 FCBGA为实现更高性能，接纳更多 I/O，提供 8/8㎛ 以下微电路技术和 Coreless 工艺，AI 加速器和服务器 CPU用 FCBGA还可提供最大达 110x110㎜ 的 Large Body 产品。
各认证机构的有效期明示略有不同。认证机构 BSI不管任证书上的截止日期，只将焦点放在认证有效性是否通过事后更新和审核。也就是说，认证书上标注了到期日期，并非表示所有认证都在那时到期，而是需要不断审核才能维持那项认证。与此相反，像TS/TL规格本身要求包含证书到期日期时，认证书上就标记了相应到期日期。需要有效确认认证书时，将为您发送 BSI发行的公文。
RoHS是关于 6种有害物质(Pb, Cd, Cr6+, Hg, PBB, PBDE)的使用规制的指南，Pb Free是只针对 Pb的规制内容。换句话说，可以说Pb Free包含在RoHS中。Pb Free 规制从几年前开始实行，RoHS是在EU自 2006年 7月 1日起开始实行的规制。，满足RoHS，自然也满足于Pb Free。
BGA是 Ball Grid Array缩写，主要用于包装用基板。这是为了实现半导体和Mainboard的电连接，与现有 Lead Frame(外围连接线)不同，采用利用 Solder Ball的实装方式，可连接多数 I/O。
为保护半导体免受外部冲击、潮湿等环境，同时可实现电信号的输入输出，起到连接半导体和外部终端的作用。
如果您有更多问题，请通过顾客咨询进行咨询，我们将竭诚为您答复
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