Samsung Electro-Mechanics will participate in the “2023 KPCA (Korea Electronics Packaging and Circuits Association) show exhibition”, which will be held for three days from September 6 to 8 at Songdo Convensia in Incheon.
KPCA is the only and largest PCB and semiconductor packaging exhibition in Korea, providing a wide range of information on the electronic circuit industry, which is the heart of the electronics industry, and showcasing advanced technologies.
Samsung Electro-Mechanics will be opening an online exhibition center on the 6th alongside the offline exhibition for visitors who are unable to physically visit the exhibition center.
The exhibition is composed of an introduction to BGA, FCBGA, and next-generation package technologies, and you can view the actual exhibition panels in the online exhibition hall just like you would in the actual offline exhibition hall. Visitors can check out BGA (FCCSP, UTCSP, SiP, Embedded)substrates, introductions to FCBGA (Standard Core, Ultra Thin Core, Server) substrates, and SoS platform, the next generation package technology.
In addition, you can watch promotional videos about Samsung Electro-Mechanics and videos on advanced processes such as plate thinning technology and miniaturization technology for semiconductor package substrates. We look forward to your visit to the online exhibition center, which will be open until September 15.