SAMSUNG ELECTRO-MECHANICS

Samsung Electro-Mechanics will participate in the 'KPCA Show 2025' (International Advanced Semiconductor Substrate and Packaging Industry Exhibition), taking place at Songdo Convensia, Incheon, from September 3 to 5. At the event, the company will showcase its next-generation semiconductor package technologies for AI, server, and automotive applications, along with glass core substrates.

'KPCA Show' is Korea’s largest PCB and semiconductor packaging exhibition, bringing together leading domestic and global companies across substrates, materials, and equipment to share the latest technological trends in semiconductor packaging and electronic circuits.

A semiconductor package substrate (FCBGA) connects high-density chips to the mainboard, transmitting electrical signals and power. As industries such as servers, AI, cloud computing, and automotive continue to evolve, package substrates have become a core element in enhancing semiconductor performance. This has driven demand for advanced technologies such as increased layer counts, finer circuit patterns, precise interlayer alignment, and reduced thickness.

As Korea’s largest package substrate manufacturer, Samsung Electro-Mechanics organized its booth under two themes: the “Advanced Package Substrate Zone” and the “AI & Automotive Package Substrate Zone.” At the center of the booth, the company presented a detailed product breakdown to illustrate how package substrates are used in real-world devices.

In the “Advanced Package Substrate Zone”, Samsung Electro-Mechanics highlighted the core technologies applied to its high-end AI and server FCBGA substrates currently in mass production. On display were the company’s most advanced products, including newly introduced substrates that are over 10 times larger in area and more than triple the number of internal layers compared to standard FCBGAs—a demonstration of the highest level of manufacturing complexity. Samsung Electro-Mechanics is the only company in Korea mass-producing server FCBGAs and is recognized for its industry-leading expertise.

The company also introduced 2.1D package substrate technology, which enables direct chip-to-chip connections without a silicon interposer, as well as Co-Package substrates that integrate SoC (System on Chip) and memory into a single board.

Of particular interest was the glass core package substrate, widely regarded as a next-generation solution. This innovation reduces thickness by about 40% compared to conventional substrates while significantly improving warpage control and signal performance in large-area substrates. Samsung Electro-Mechanics plans to lead the future market by reinforcing its core technologies and strengthening collaboration with global clients.

In the “AI & Automotive Package Substrate Zone”, the company exhibited FCCSP (Flip Chip Chip Scale Package) substrates for AI smartphone APs—boasting the No. 1 global market share—alongside high-reliability FCBGA substrates for automotive use, ultra-thin UTC (Ultra Thin Core) substrates for AI laptops, and embedded substrates with built-in passive components.

Eungsoo Kim (EVP), Chief of Package Solution Business Unit at Samsung Electro-Mechanics, stated: “Samsung Electro-Mechanics continues to secure differentiated technologies in the high-end semiconductor package substrate market for AI, autonomous driving, and servers. Going forward, we will strengthen partnerships with global clients and drive future growth by leveraging our high-performance substrate technologies.”

In October 2022, Samsung Electro-Mechanics became the first company in Korea to successfully mass-produce AI and server FCBGA substrates, earning recognition for its technological leadership. Looking ahead, the company will focus on securing capabilities in ultra-large-area, ultra-high-layer, and ultra-fine circuit implementation, as well as expanding the use of glass materials, to drive leadership in the high-end semiconductor package substrate market for advanced servers, networks, and autonomous driving.