SAMSUNG ELECTRO-MECHANICS

On the 21st, Samsung Electro-Mechanics Package Development Team Leader, VP Hwang Chiwon, received the Presidential Commendation at the 20th Electronics & IT Day awards ceremony for his contributions to strengthening the competitiveness of Korea’s materials and components industry. This award recognizes his leadership in pioneering next-generation technology development and advancing global competitiveness in the semiconductor package substrate sector over the past 20 years.

‘Electronics & IT Day’ was established in 2005 to commemorate Korea surpassing $100 billion in exports in the electronics and IT sector. On this day, industrial orders, presidential and prime ministerial commendations, and ministerial commendations are awarded to individuals who have contributed to the development of the industry and the enhancement of the nation’s global standing.

Since joining the company in 2011, VP Hwang has led the development of cutting-edge technologies and manufacturing processes for package substrates, contributing to the technological independence of Korea’s domestic substrate industry and boosting its global competitiveness.

In particular, he developed Korea’s first high-performance server semiconductor package substrate, and began mass production and supply to leading global clients in 2022, elevating Korea’s standing in the global substrate market. He also secured new package substrate architectures and yield-enhancement technologies that deliver both power efficiency and high performance, achieving technological differentiation and strengthening cost and quality competitiveness.

Furthermore, by being the first in the world to mass-produce next-generation semiconductor package substrates such as coreless substrates, Si Cap embedded substrates, and ARM-based CPU packages, he has led the development of next-generation SoS (System on Substrate) technologies and products targeting future growth markets like AI, cloud, and automotive electronics. As a result, Samsung Electro-Mechanics' package substrate business has secured top-tier global competitiveness in both technology and market leadership.

VP Hwang is also contributing to enhancing production capabilities and responsiveness to global customers

by expanding new production facilities in Busan as a development hub, and plans to further reinforce Samsung Electro-Mechanics' technological leadership in line with the rapid growth of the high-performance semiconductor substrate market.

VP Hwang stated:

"It is deeply meaningful that Samsung Electro-Mechanics’ package substrate development technology has been recognized with this award. We will continue to lead the development of high-performance semiconductor package substrate technologies, which will become the core infrastructure for future industries such as AI, cloud computing, and automotive electronics.”

Since successfully mass-producing FCBGA for servers for the first time in Korea in October 2022, Samsung Electro-Mechanics has been recognized for its industry-leading technological capabilities. Looking ahead, the company plans to increase the share of high-value-added FCBGA products to over 60% by 2026, focusing on the premium semiconductor substrate markets for servers, networks, and autonomous vehicles in line with the expansion of the cloud industry.