HPC(High Performance
Computing)
High Temperature MLCC
Heat Dissipation Structure
![(Heat Sink, CPU, Clip Socket, Clip Socket, PCB Board) →Degradation of MLCC’s Life & Capacitance](/resources/images/global/newsroom/exhibition2022/view/hpc/sec2_img1_1.jpg)
MLCC Life Expectancy by Temp.
![X-axis : Product Temp.(℃), Y-axis : Useful lifetime (Year) / XSR, X6*, X7* (At Rated Voltage X 80%) / Life Expectancy Target / X6* > Longer MLCC's Life > X7*](/resources/images/global/newsroom/exhibition2022/view/hpc/sec2_img1_2.jpg)
![-X6*/X7* MLCCs for High Performance CPU(Status : Now(X6* (105℃) 0603i 47uF) > '24(0603i 100uF) > Next(X7* (125℃) )](/resources/images/global/newsroom/exhibition2022/view/hpc/sec2_img2.jpg)
Advanced Packaged Substrate
![](/resources/images/global/newsroom/exhibition2022/view/hpc/sec3_img1.jpg)
- Embedding Structure
- Better Performance (Power Integrity↑)
- FCBGA(DSC,IC,DSC), FCBGA(EPS)
- Voltage Drop (mV) - DSC+LSC(67mV) > Power Integrity 45%↑ > DSC+LSC+EPS(36)
- Asymmetric EPS (Core 1.2T)
![](/resources/images/global/newsroom/exhibition2022/view/hpc/sec3_img2.jpg)
- Die to Die interconnection PKG Substrate
- Large Body, High Layer Count, Fine Line & Space
- 2.5D(HBM, Logic, HBM) > 2.1D(HBM, Logic, HBM(L/S 2/2μm)
- L/S=9/12μm > L/S=2/2μm