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HPC(High Performance
Computing)

High Temperature MLCC

Heat Dissipation Structure
(Heat Sink, CPU, Clip Socket, Clip Socket, PCB Board) →Degradation of MLCC’s Life & Capacitance
MLCC Life Expectancy by Temp.
X-axis : Product Temp.(℃), Y-axis : Useful lifetime (Year) / XSR, X6*, X7* (At Rated Voltage X 80%) / Life Expectancy Target / X6* > Longer MLCC's Life > X7*
-X6*/X7* MLCCs for High Performance CPU(Status : Now(X6* (105℃) 0603i 47uF) > '24(0603i 100uF) > Next(X7* (125℃) )

Advanced Packaged Substrate

Embedding Structure
Better Performance (Power Integrity↑)
FCBGA(DSC,IC,DSC), FCBGA(EPS)
Voltage Drop (mV) - DSC+LSC(67mV) > Power Integrity 45%↑ > DSC+LSC+EPS(36)
Asymmetric EPS (Core 1.2T)
Die to Die interconnection PKG Substrate
Large Body, High Layer Count, Fine Line & Space
2.5D(HBM, Logic, HBM) > 2.1D(HBM, Logic, HBM(L/S 2/2μm)
L/S=9/12μm > L/S=2/2μm
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