Small Size / Low Profile Component
Smart Phone : New Form Factor Design (5G & Foldable)
Space Saving with Small Size MLCC (0201inch → 01005i)
- Bar(PCB, Battery) > Downsizing > Clamshell(PCB,Battery,Battery), Foldable (PCB,Battery,PCB,Bettery)
- Bar(0201i 14%) → Clamshell(22%), Foldable(20%)
- Bar(01005i 52%) → Clamshell(55%), Foldable(54%)
- MLCC: 60mm(Conventional(0201i1μF)) > 48%↓ > 34(DownSizing(01005i 1μF))
- *Source:A Company Flagship Samrtphonce
Making Slim Design Possible (MLCC/PI : 0.8T → 0.65T → 0.5T~0.55T)
- Battery,Battery, PCB (6.9T)
- 6.9> 2-Stack PCB (AP,MLCC,PCB,PMIC,MLCC,PI,PCB,IC,RF)
- Low Profile MLCC/PI(Max T)
- Year : '20:0.9~1.0T > '21,'22:0.75~0.85T > '22:0.65T > '24:0.6~0.7T(Interposer Thickness(2-Stacked PCB Interposer)
- Year : '20:0.8T(Components Thickness(0.3↓) > '21:0.65T > '22:0.65T > '24:0.5T~0.55T