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New Form Factor

Small Size / Low Profile Component

Smart Phone : New Form Factor Design (5G & Foldable)
Foldable > Small & Low T (Battery Size↑, Space Issue) > 5G
Space Saving with Small Size MLCC (0201inch → 01005i)
  • Bar(PCB, Battery) > Downsizing > Clamshell(PCB,Battery,Battery), Foldable (PCB,Battery,PCB,Bettery)
  • Bar(0201i 14%) → Clamshell(22%), Foldable(20%)
  • Bar(01005i 52%) → Clamshell(55%), Foldable(54%)
  • MLCC: 60mm(Conventional(0201i1μF)) > 48%↓ > 34(DownSizing(01005i 1μF))
  • *Source:A Company Flagship Samrtphonce
Making Slim Design Possible (MLCC/PI : 0.8T → 0.65T → 0.5T~0.55T)
Battery,Battery, PCB (6.9T)
6.9> 2-Stack PCB (AP,MLCC,PCB,PMIC,MLCC,PI,PCB,IC,RF)
Low Profile MLCC/PI(Max T)
Year : '20:0.9~1.0T > '21,'22:0.75~0.85T > '22:0.65T > '24:0.6~0.7T(Interposer Thickness(2-Stacked PCB Interposer)
Year : '20:0.8T(Components Thickness(0.3↓) > '21:0.65T > '22:0.65T > '24:0.5T~0.55T

Slim / High Performance Camera

Slim Factor Camera for Bigger Size Sensor
'21(S/F0.6) : High CRA *Slim Factor = Sensor Diagonal Length/TTL (Total Track Length) > '22(0.55) : Pop Out Lens > '24(0.4) : Array Lens - Ref.108M Lens(7.38mm, Φ12.52mm) > 40% TTL Reduction > 2x2 CIM Lens(4.3mm, Φ12.52mm)
High Performance Camera
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