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Package Substrate

WBCSP

(Wire Bonding Chip Scale Package)

Wire Bonding High-Density Package Substrate for Memory

A product that connects semiconductor chips and package substrates with gold wire and whose chip size exceeds 80% of the
package substrate area is generally referred to as WBCSP (Wire Bonding Chip Scale Package). It uses gold wire to connect the chip
to the PCB and is mainly used for memory chips because it can be multi-packaged. In particular, UTCSP (Ultra Thin CSP) products can
be manufactured with a thickness of 0.13㎜ or less. With a high degree of freedom in chip to PCB connection, multi-chip packaging is
possible and high performance can be realized compared to packages of the same thickness.

WBCSP(Wire Bonding Chip Scale Package)

WBCSP Lineup

Lineup by Specification

General WBCSP Road Map of HVM / Sample Product

Mass Production Sample Available
Lineup by Specification - Routing Density
Routing Density Bond Finger Pitch 55P (25 / 12, Ni 3) (Mass Production) 50P (20 / 10, Ni 2) (Sample Available)
Line Width / Space mSAP
(Cu T 14)
12 / 16um(Mass Production) 10 / 15um(Sample Available)
ETS
(Cu T 13)
7 / 8um (Mass Production) 6 / 7um (Sample Available)
Via / Pad Size mSAP 50 / 90um(Mass Production) 45 / 85um(Sample Available)
ETS 40 / 65um (Mass Production) 37 / 60um (Sample Available)
SRO alignment ± 12.5um (Mass Production) ± 10um (Sample Available)
Min. SR Open size 45um (Mass Production) 40um (Sample Available)

* um stands for ㎛

Lineup by Structure & Z-Height
Mass Production Sample Available
Lineup by Structure & Z-Height - Layer Count, Structure, Thickness
Layer count Structure Thickness
2Layer (Mass Production) Cored (Mass Production) 80um (Mass Production) 75um
3Layer (Mass Production) Coreless (Mass Production) 80um (Mass Production) 75um
ETS (Mass Production) 120um (Mass Production) 100um
4Layer (Mass Production) Cored (Mass Production) 120um (Mass Production) 110um
Coreless (Mass Production) 110um (Mass Production) 100um
ETS (Mass Production) 160um (Mass Production) 140um
6Layer (Mass Production) Cored (Mass Production) 220um (Mass Production) 180um
Coreless (Mass Production) 200um (Mass Production) 180um

* um stands for ㎛

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